Total solution including HiDensity technologies according to your requirement.

Module assembly
- Die: MCM, die bonding, hybrid, COB, FLIP-CHIP, IMS
- SMD: thick or thin film technology

ASIC design, prototypes, volume
ASIC assembly dice or SMD
P.C. Board (flex, rigid, and flex-rigid)
- Design, prototypes, production volume, conventional, - PTH, double sided and multiplayer.

Protection
- TVS: Transient Voltage Suppressor diode
- GDT: Gas Discharge Tube
- Breakover diode
- Resistor: High voltage, High energy